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SMARC Compatible Carrier Board for MiniPC applications

Technical Features:

2× HDMI ports with CEC
1× DP Alternate Mode via USB-C
1× 2.5 Gb Ethernet port via RJ45
2× USB-A 3.0, 1× USB-C 2.0, 1× USB-C 3.2
PCI Express M.2 slot (Key E)
2× USB-C PD ports with DRP
Sink voltage: up to 20 V
Source voltage: 5 V
Power over Ethernet Plus (PoE+)

PCB/PCBA Characteristics:

Number of components: 640
Number of layers: 6
Number of hidden nets: 3 (1% of total 495)
Max. trace width: 39 mils
Min. trace width: 2 mils
Thru hole via count: 982

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SMARC 2.2 SOM

Technical Features:

SMARC 2.2 pinout
Intel® Alder Lake N / x7000E Series
Single-CH LPDDR5 4800MT/s up to 16GB
Supports IBECC
2.5GbE LAN
PCIe Gen3, USB3.2 Gen2, SATA (optional)
On-board eMMC (optional)
Embedded Software APIs

PCB/PCBA Characteristics:

Number of components: 830
Number of layers: 12
Number of hidden nets: 529 (75% of total 706)
Number of unrouted nets: 90 (13% of total 706)
Blined via count: 596
Max. trace width: 39 mils
Min. trace width: 2 mils
Thru hole via count: 2033

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PCI Card

Technical Features:

Artix UltraScale+ FPGA
2× 16Gb DDR4 memory chips (1× 16Gb DDR4 for 1ETH variant)
2 or 1 ×10G ETH by AQR113-B1-C PHY
512Mbit SPI Flash for FPGA configuration
10× DC-DC converters with I2C control
Power sequence manager with JTAG configuration
PCIe x4 edge connector
2-color status LED

PCB/PCBA Characteristics:

Number of components: 624
Number of layers: 10
Max. trace width: 157 mils
Min. trace width: 3 mils
Thru hole via count: 1675

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Compatible SMARC Carrier Board

Technical Features:

ETH: 2× GBE ports with custom PoE solution and serial interface
LVDS: 1× interface up to 1920x1080 pixel
HDMI OUT: Debug and testing only
HDMI IN: Optional feature
USB:
- 2× USB 2.0 for touch and SD reader
- 2× USB 3.0 for HDMI capture and 4-port hub

PCB/PCBA Characteristics:

Number of components: 702
Number of layers: 6
Max. trace width: 39 mils
Min. trace width: 5 mils
Thru via count: 1430

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IO Board

Technical Features:

Device for controlling and monitoring the robotic surgical operation device
MCU: ATSMC21J16
Hardware save state logic
RS232 interface
Analog and Digital inputs and outputs

PCB/PCBA Characteristics:

Number of components: 521
Number of layers: 4
Max. trace width: 59 mils
Min. trace width: 5 mils
Thru hole via count: 778

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BLDC Motor Control Evaluation Board

Technical Features:

FPGA: AMD-Xilinx Artix UltraScale+
DDR4 SDRAM 8–16 GB
SLVS-EC 8-lane Sony IMX455 compatible
Two temperature sensors supported
SFP+ module (2 W max, SFF-8418/8419)
USB / Serial: FT2232HP dual-channel
GPIO for expansion via test points
Trigger isolator: ISOW7821

PCB/PCBA Characteristics:

Number of components: 303
Number of layers: 4
Max. trace width: 59 mils
Min. trace width: 5 mils
Thru hole via count: 507

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External SSD enclosure with thunderbolt 5

Technical Features:

Various SSD sizes support: type 2230,type 2242, type 2260, type 2280, type 22110, type 25110.
NVME SSDs support
Powerfull SSDs (up to 9W support)
Cooling fan for the most powerfull SSD units.

PCB/PCBA Characteristics: