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Get a real PCB, assembly & box-build quote in 24 hours

Upload your design files — our engineers review every board and reply with itemized pricing, not an instant-quote algorithm.

2–24 layers · HDI · Flex / Rigid-flex · 3 mil traces · 0.1 mm vias · Class 3 IPC

SMT + THT assembly · cable harnesses · enclosure integration · functional test

Drop Gerber or ODB++ files here

or
Supported: Gerber RS-274X · ODB++ · IPC-2581 · ZIP archive
What you'll get back

A detailed quote, by email

  • Cost estimate per unit + setup
  • Lead time from order to ship
  • Material options for your design
  • Test coverage recommendations
Why DigitalGate
  • Same-business-day quote review by our engineers
  • EU-based manufacturing — no customs surprises
  • In-house from schematic to final assembly & test
  • Class 3 IPC-A-610 inspection on every board
Typical turnaround
[24 hours]
PROCESS

How it works

1

Upload

Drop your design files in the box above.

2

Review

Our engineers check the design and flag anything unusual.

3

Quote

Detailed estimate by email within 24 hours.

4

Build

You confirm — we manufacture the boards, assemble, integrate and ship.

SPECS

Manufacturing capabilities

Standard production
Max layers
[24]
standard production
Min trace width
[3]
mils
Min via diameter
[0.15]
mm
Max panel size
[500×600]
mm
MaterialsFR-4Rogerspolyimide
Surface finishesHASLENIGENEPIGOSP
Solder maskGreenRedBlueBlack
SilkscreenWhiteBlack
High-speed & HDI
Controlled impedance
[±5%]
single-ended / differential
Min BGA pitch
[0.35]
mm
HDI build-up
[3+N+3]
sequential lamination
Back-drilling
[< 0.2]
mm residual stub
Microviaslaser-drilledstackedCu-filled
High-speed laminatesMegtron 6RogersI-Speed
Via-in-padCu-filledplanarized
Min annular ring4 mil
PORTFOLIO

Recent projects

SMARC 2.2 SOM

SMARC 2.2 SOM

12-layer system-on-module on the SMARC 2.2 form factor — Intel Alder Lake N compute platform for industrial edge applications.

SMARC Carrier Board

SMARC Carrier Board

6-layer high-density I/O carrier — dual Gigabit Ethernet, dual HDMI, USB 3.0 and USB-C, with a full SMARC compute-module socket.

Edge Mini-PC

Edge Mini-PC

Compact fanless single-board computer with PROFINET-ready Ethernet, USB 3.0 / USB-C, HDMI and M.2 expansion for cellular or Wi-Fi.

BLDC Motor Controller

BLDC Motor Controller

Three-phase brushless DC motor drive with high-current power stage and integrated control MCU.

PCIe FPGA Accelerator

PCIe FPGA Accelerator

Low-profile PCIe x4 card with AMD–Xilinx Artix UltraScale+ FPGA and Gigabit Ethernet interface.

Surgical Robot I/O Board

Surgical Robot I/O Board

Medical-grade controller for hip-surgery robotic systems — pump, fan, safety inputs and RS-232 host interface.

Thunderbolt SSD Enclosure

Thunderbolt SSD Enclosure

PCIe-based external NVMe storage with a Thunderbolt controller for high-bandwidth data transfer.

FACILITY

Assembly, test & box build in-house

Solder paste printer

Stencil printer with [±25 µm] alignment accuracy

Solder paste printer

Pick & place

Up to [X,000] parts/hour, 0201 to BGA support

Pick & place

Reflow oven

Lead-free profile, [10]-zone with nitrogen capability

Reflow oven

Functional test

AOI + ICT + custom fixtures per project

Functional test

Flying probe test

Programmable probe-based electrical test (Takaya APT) — no fixtures needed, ideal for prototypes and low-volume runs.

Flying probe test

X-ray inspection

Nordson Quadra Pro Series X-ray — sub-micron resolution for BGA / QFN voiding, hidden joints and component-level defects.

X-ray inspection

Have a non-standard request?

Exotic materials, compliance-driven design, or anything outside the calculator’s scope — our engineering team will scope it directly, including enclosure mechanics and cable assemblies.